Intel announced in 2022 it might put up to $100 billion into Ohio, with production originally aimed at 2025. Those two plants slipping to the next decade is the vacuum Hynix would be walking into.
Hynix already packages HBM in Indiana. A U.S. wafer fab would be a different industrial bet: DRAM, NAND, or HBM silicon, not just advanced packaging. Reuters could not learn which products are in discussion.
For anyone watching AI hardware costs, this is the supply-side attempt to answer yesterday’s scarcity story. It is also a political object. Seoul treats memory process technology as a national core technology; Washington wants a faster U.S. commitment. No deal, no chip type, no timeline beyond ‘talks.’
South Korea’s SK Hynix is talking with Intel about manufacturing memory chips on U.S. soil for the first time, three people familiar with the discussions told Reuters.
Options on the table include leasing part of Intel’s Ohio campus — now delayed to 2030 and 2031 — or forming a venture with Intel and major cloud firms. SK Hynix says it is reviewing additional production bases and that nothing has been determined.